Electronic component cooling apparatus



FIG. 1 is a front elevation view of a first embodiment of an electronic component cooling apparatus showing our new design;

FIG. 2 is a rear elevation view of the first embodiment of the cooling apparatus;

FIG. 3 is a right side elevation view of the first embodiment of the cooling apparatus;

FIG. 4 is a left side elevation view of the first embodiment of the cooling apparatus;

FIG. 5 is a top plan view of the first embodiment of the cooling apparatus;

FIG. 6 is a bottom plan view of the first embodiment of the cooling apparatus;

FIG. 7 is a top plan reference view of the first embodiment of the cooling apparatus;

FIG. 8 is a longitudinal cross sectional view of the first embodiment of the cooling apparatus;

FIG. 9 is a perspective view of the first embodiment of the cooling apparatus;

FIG. 10 is a front elevation view of a second embodiment of an electronic component cooling apparatus showing our new design;

FIG. 11 is a rear elevation view of the second embodiment of the cooling apparatus;

FIG. 12 is a right side elevation view of the second embodiment of the cooling apparatus;

FIG. 13 is a left side elevation view of the second embodiment of the cooling apparatus;

FIG. 14 is a top plan view of the second embodiment of the cooling apparatus;

FIG. 15 is a bottom plan view of the second embodiment of the cooling apparatus;

FIG. 16 is a top plan reference view of the second embodiment of the cooling apparatus;

FIG. 17 is a longitudinal cross sectional view of the second embodiment of the cooling apparatus taken along line 17—17 in FIG. 16; and,

FIG. 18 is a perspective view of the third embodiment of the cooling apparatus. 

The ornamental design for an electronic component cooling apparatus, as shown and described. 